- CATARC, OMNIVISION inaugurate joint automotive chip testing lab in Tianjin
Recently, CATARC and OMNIVISION jointly established the CATARC-Omnivision Automotive IC Joint Laboratory in Tianjin Economic-Technological Development Area (TEDA).
Sept. 04 , 2024
- NVIDIA Enables New Experiences in the Automotive Industry with End-to-End Large Models
The automotive industry is experiencing fundamental changes, where AI-based algorithms, computing, and data are continually powering the evolution of the intelligent automotive industry.
July 26 , 2024
- HOUMO.AI nabs hundreds of millions of yuan for AI chip development
Recently, integrated storage and computing AI chip company HOUMO.AI completed a strategic financing round worth hundreds of millions of yuan, with investment from funds under China Mobile.
July 15 , 2024
- MeriTech secures nearly 100 million yuan in Series A+, B funding rounds
Recently, Meritech Integrated Circuits Co., Ltd., based in Beijing, announced the completion of two consecutive funding rounds within six months, raising a total of nearly 100 million yuan.
July 12 , 2024
- LinkPowerIC bags over 100 million yuan in angel, Pre-A funding rounds
Automotive communication chip and solution provider LinkPowerIC recently announced it secured over 100 million yuan in angel and Pre-A funding rounds.
July 12 , 2024
- EtlChip closes Pre-A++ funding to advance automotive Ethernet chips
On July 4, Chinese Ethernet chip developer EtlChip announced the completion of its Pre-A++ round of financing, led by Cornerstone Ventures.
July 04 , 2024
- Polar Bear Tech secures new funding to develop first independent chiplet product library
Recently, Chinese chiplet design company Polar Bear Tech announced the completion of a new round of financing, introducing V Fund as an investor.
June 12 , 2024
- NOVAUTO nabs hundreds of millions of yuan in Pre-B financing
On May 9, NOVAUTO announced the completion of Pre-B round financing, which raised for the company hundreds of millions of yuan.
May 10 , 2024
